WCu heat sinks It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be disigned by controlling the content of t
CPC heat sinks Cu/Mo70Cu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness
Cu/Mo-Cu/Cu heat sinks Cu/Mo70Cu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness
Cu/Mo70-Cu/Cu electronic packaging materials Cu/Mo70Cu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness
Cu/Mo/Cu electronic packaging materials Cu/Mo/Cu (CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity
Cu/Mo/Cu Materials Cu/Mo/Cu (CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity
Molybdenum-Copper heat sinks It is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo-Cu is much lighter tha
Mo-Cu electronic packaging materials It is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo-Cu is much lighter tha
Tungsten-Copper heat sinks It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be disigned by controlling the content of t
W-Cu electronic packaging materials It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be disigned by controlling the content of t
