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Changsha Saneway Electronic Materials Co., Ltd.

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Central South University, Changsha, China

86-731-88877698

Binxia Wang

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Cu/Mo70-Cu/Cu electronic packaging materialsCu/Mo70Cu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness Cu/Mo/Cu electronic packaging materialsCu/Mo/Cu (CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivityMo-Cu electronic packaging materialsIt is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo-Cu is much lighter thaTungsten-Copper heat sinksIt is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be disigned by controlling the content of tW-Cu electronic packaging materialsIt is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be disigned by controlling the content of t

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